SUMIKASUPER E6000HF Series

Ultra-highly heat-resistant grade with high fluidity and low warpage characteristics that is well suited for molding fine structures

High-precision molding / High fluidity / Applicability to lead-free soldering (SMD)

Grade Filler Feature Application
E6007LHF GF35% standard grade RIMM, DDR
E6807LHF GF/inorganic series 35% low warpage CPU socket, S/O, DIMM
E6808LHF GF/inorganic series 40% ultra-low warpage CPU socket
E6808UHF GF/inorganic series 40% high fluidity,
ultra-low warpage
BtoB fine pitch connector,
FPC fine pitch connector
E6810LHF GF/inorganic series 50% ultra-low warpage card connector
SZ6506HF inorganic series 30% ultra-high fluidity,
ultra-low warpage
BtoB fine pitch connector,
FPC fine pitch connector
Usage examples of SUMIKASUPER E6000HF Series
Usage example1 of SUMIKASUPER E6000HF Series Usage example2 of SUMIKASUPER E6000HF Series
Inquiries about SUMIKASUPER LCP