Ultra-highly heat-resistant grade with excellent reflow performance and high rigidity under heat that are required for relay cases and bobbins

Heat resistance / Low gas generation / Applicability to lead-free soldering(dipping) : up to 380 deg C *

* The period for solder dipping is assumed to be 1 to 2 seconds.
However, thermal-resistant temperatures of samples may be affected by their shapes.

Grade Filler Feature Application
E4008 GF40% standard grade, high heat resistance,
high fluidity, high tolerance
various bobbins,
relay case
E4009 GF45% high heat resistance,
high rigidity, low warpage
relay case
Usage example of SUMIKASUPER E4000 Series

provided by OMRON RELAY & DEVICES Corporation

Inquiries about SUMIKASUPER LCP