PRODUCT
IGETABOND™

PRODUCT

IGETABOND™

Igetabond™

Igetabond™(IB) is an ethylene-glycidyl methacrylate (E-GMA) co-polymer. Igetabond™ exhibits excellent reactivity and adhesion to a wide variety of materials due to its epoxy group.

Form	Pellet
Melting point	50~105℃
MFR (190℃, 21.2N)	3–7g/10min (excluding some grades)
Glass transition temperature (Tg)	< -25℃
Elongation at break (E)	> 500%

PE: Polyethylene, PP: Polypropylene, Acryl: Polymethyl methacrylate, PET: Polyethylene terephthalate, PBT: Polybutylene terephthalate, PC: Polycarbonate, PA: Polyamide, PPS: Polyphenylene sulfide, PPE: Polyphenylene ether, PLA: Polylactic acid, ETFE: Ethylene-Tetrafluoroethylene Copolymer, PVF: Polyvinyl fluoride, PVC: Polyvinyl chloride, Al: Aluminum, Fe: Iron (stainless steel), Cu: Copper

Grades

Polymer Type			E-GMA Copolymer				E-GMA-VA Terpolymer		E-GMA-MA Terpolymer		Copolyester Component
Item	Test Method	Unit	BF-2C	BF-E	BF-30C	CG5001	BF-2B	BF-7B	BF-7L	BF-7M	VC40
Glycidyl Methacrylate(GMA) Cont.	Sumitomo-Method	wt%	6	12	19	19	12	12	3	6	－
Vinyl Acetate (VA) Cont.	Sumitomo-Method	wt%	－	－	－	－	5	5	－	－	－
Methyl Acrylate (MA) Cont.	Sumitomo-Method	wt%	－	－	－	－	－	－	27	27	－
MFR	JIS K7210-1^*1	g/10min	3	3	30	380	3	7	7	7	7
Density	JIS K7112	kg/m3	930	940	960	950	950	950	960	960	1130
Tensile Strength at Break	ASTM D638^*2	MPa	18	19	11	4	19	17	4	3	16
Elongation at Break	ASTM D638^*2	%	650	700	730	250	750	750	850	1000	650
Apparent Bending Modulus	ASTM D747	MPa	98	69	－	3	39	39	6	4	400
Vicat Softening Point	JIS K7206	℃	83	75	61	45	68	66	< 25	< 25	65
Brittle Point	JIS K7216	℃	< -70	< -70	－	－	< -70	< -70	< -70	< -70	< -70
Melting Point	Sumitomo-Method (DSC)	℃	105	103	96	88	95	95	60	52	95
Glass Transition Temperature (Tg)	Sumitomo-Method (DSC)	℃	-26	-26	-29	-27	-28	-28	-33	-33	－
Moisture Absorption	JIS K6911	%	< 0.01	< 0.01	－	－	< 0.02	< 0.02	< 0.05	< 0.05	0.21

*1: 190℃, 21.2N;
*2: Type IV specimen at an elongation rate of 200mm/min.
The values given are standard values and not to be considered as sales specifications or guaranteed values.

Features

High reactivity to a variety of compounds or polymers with functional groups
High flexibility and ductility
Excellent adhesion properties to various materials
Excellent processability by extrusion and injection molding
Wide range of E-GMA, E-GMA-VA, and E-GMA-MA grades

Applications

1. Polymer modifier

Since Igetabond™ possesses an epoxy group, it is effective in improving impact resistance or inhibiting polymer hydrolysis when alloyed with engineering plastics having a reactive functional group.
(Ex.: PET, PBT, PC, PPS, PES, PPE, and PA)

①Modifying PBT (Impact resistance)

E-GMA functions as a compatibilizer for PBT and rubber components and improves the rubber dispersibility in PBT and impact resistance of PBT/rubber composite.

PBT/Rubber components
PBT/Rubber components/ E-GMA

Izod impact strength of notched specimens at 23℃ [kJ/m²]

②Modifying PPS (Impact resistance)

E-GMA-MA can improve impact resistance without blending rubber components.

③Modifying PPS (Heat cycle resistance)

Igetabond™ improves resistance to heat cycle.

<Test condition>

1 cycle :
180℃ 2hrs → -40℃ 2hrs → 180℃

Evaluation method :
Counting the number of cycles until cracks emerge in the molding

Sample :
Insert-injected molding (metal pin with minimum thickness of 1 mm)

④Modifying PET (Hydrolysis resistance)

Igetabond™ improves the hydrolysis resistance of PET.

<Test conditions>

Resins were immersed in 80℃ pure water, and MFR was measured after a predetermined number of days.

MFR measurement conditions:
Temperature: 260℃
Load: 21.2N

2. Asphalt modifier (Improving of peeling strength to aggregates)

Test method: Test method for Coating and Stripping of Asphalt-Aggregate Mixtures (JPI-5S-27-86)
Test conditions: Sample was immersed in water at 80℃ for 1 week
Test piece: Straight asphalt/SBS/anti-stripping agent=100/4/0.15

Asphalt coating aggregate after 1 week immersed in pH=10 water.

No anti-stripping agent
With Igetabond™ (E-GMA)

3. Adhesive applications

Thermal bonding properties of Igetabond™ with various materials

Igetabond™ shows good adhesion to various substrates.

*Corona discharge treatment

Adhesive resin	Base layer (substrate)
	Commodity Resins				Engineering Plastics			Fluorocarbon Polymers		Metals
	LDPE	PP	PS	Soft PVC	PET^*	PC	PA	ETFE^*	PFA^*	SUS	Al	Fe	Cu

BF-E	◎	◎	〇	×	〇	◎	×	◎	〇	◎	◎	〇	◎
BF-7B	◎	◎	〇	△	〇	◎	△	◎	〇	◎	◎	〇	〇
VC-40	〇	△	〇	◎	◎	◎	〇	〇	×	◎	◎	〇	◎

MAH grafted PE	◎	〇	×	×	△	×	◎	×	×	◎	◎	◎	×
MAH grafted EVA	◎	◎	×	×	〇	×	◎	×	×	◎	◎	◎	◎
EAA copolymer	◎	×	×	×	〇	×	◎	×	×	◎	◎	◎	◎

Substrate/Adhesive resin (50μm)/LDPE (50μm)
LDPE layer was sealed via a heat sealer (190℃, 3kg/cm², 3sec)
Peeling conditions: 180°angle, 100mm/min speed

Precautions

Notes to prevent Igetabond™ gelation in extruder.

Prolonged residence of Igetabond™ in a hot extruder can cause gelation due to thermal ring opening of the epoxy group.
When interrupting or stopping the operation of the extruder, make sure to purge the Igetabond™ fully. LDPE with MFR of 3-5 g/10 min is generally used for the purge resin.
Avoid melting or mixing Igetabond™ with polymers having high reactivity to epoxy groups in the extruder. Doing so may cause significant gelation.

Inquiry

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