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Electrical and Electronics
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- Board to Board Connectors
- A connector that connects printed circuit boards to boards or boards to FPCs inside electronic devices and systems. High fluidity, low warpage, and high heat resistance are required.
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- Micro Board-to-Board, Board-to-FPC Connectors
- Ultra-compact board-to-board connector for high-density mounting on printed circuit boards for smartphones and wearable devices. Ultra-thin wall flow, low warpage, and high heat resistance are required.
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- FPC Connectors
- A connector that connects FPC (flexible printed circuit board) and PCB (circuit board). Low warpage, high fluidity, and high weld strength are required.
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- DDR/M2 (NGFF) Connector
- Also known as a card edge connector, this connector is used by inserting a module card into a card slot. Low warpage and dimensional stability are required.
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- I/O Connectors
- A connector that connects information and signals between devices, also known as an I/O (input/output) or (I/F) interface (I/F) connector. Low warpage, high fluidity, and high strength are required.
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- USB Type-C Connector
- A USB connector that is widely used, primarily in smartphones and tablets. High flowability, low warpage, and blister resistance are required.
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- Card Connector
- A connector that connects a card-type semiconductor memory with contacts to a printed circuit board. High flowability, low warpage, and high thin-wall strength are required.
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- Pin Header Connectors
- A terminal that is inserted into a printed circuit board, surface mounted, and sandwiched between circuit boards to secure space between multiple boards. High fluidity, high heat resistance, and high rigidity are required.
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- High Frequency Coaxial Connector
- A connector that connects a coaxial cable to a device (electrical appliance) and transmits and receives high-speed electrical signals. It requires high fluidity, low dielectric constant, and low dielectric dissipation factor.
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- High-speed transmission connector
- A connector for high-speed transmission with impedance matching and crosstalk reduction, etc. High fluidity, dielectric constant control, and low dielectric tangent are required.
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- Battery, power connector
- Connectors used to connect to batteries and power sources, requiring high fluidity, low warpage, and high strength.
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- CPU Socket Connector
- A connector for inserting and fixing a microprocessor into the main board inside a computer. High fluidity, low warpage, high strength, and high heat resistance are required.
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- Transformer Bobbin
- The bobbin around which the wire is wound to form the transformer. It is required to have high insulation properties, high heat resistance, high strength, and high rigidity.
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- Coils and inductors
- A coil made of thin conducting wire wound in a spiral shape. An inductor can store electrical energy in the form of magnetism. It must be highly insulating, heat-resistant, strong, and rigid.
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- Optical Pickup Bobbin
- Bobbins for optical disk read/write devices. High fluidity, high heat resistance, and high rigidity are required.
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- Relay cover (sealed type)
- A sealed case to prevent foreign matter such as dirt and dust, as well as corrosive gases, from entering the relay. High heat resistance, low gas generation, low dust generation, and high dielectric strength are required.
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- Relay cover (open type)
- An open-type case that prevents foreign matter such as dirt and dust, as well as corrosive gases, from entering the relay. High heat resistance, low gas generation, low dust generation, and high dielectric strength are required.
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- Relay Base
- Relay bases are built into the control panels and printed circuit boards of machines and electrical equipment to facilitate easy installation and removal. They are required to have high heat resistance, low gas generation, low dust generation, and high dielectric strength.
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- Relay coil sealing
- Sealing material that insulates coils and protects them from external environments such as moisture and dust. High heat resistance, low gas generation, low dust generation, and high dielectric strength are required.
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- SMT/SMD Switches
- An SMT compatible switch that opens and closes the current in a circuit by pressing a button, sliding a knob, etc. High heat resistance, low gas generation, low dust generation, high fluidity, and high dimensional accuracy are required.
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- SMT Terminal Blocks
- Terminal blocks are installed on printed circuit boards and electrically connect to other boards or components via wires or cables. They are required to have high heat resistance, low gas generation, low dust generation, and low warping.
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- Printer fuser
- A unit that fuses the toner image transferred onto the paper using heat and pressure. High heat resistance, heat insulation, dimensional stability, and high strength are required.
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- Printer fixing unit peripheral parts
- Parts that transport paper before and after toner fusing and covers that cover the entire fusing section. High fluidity and low warping are required.
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- LED Housing
- Reflector for LED package or element holding material. High heat resistance, high fluidity, low water absorption, high whiteness, and colorfastness are required.
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- Heat dissipation substrate (MCCL)
- Metal wiring board with excellent heat resistance and thermal conductivity. High heat resistance, thermal conductivity, and adhesion are required.
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- Burn-in Socket
- A socket for performing burn-in tests on semiconductor devices. High heat resistance, high fluidity, and dimensional stability are required.
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- Optical Connector
- A connector used as an alternative material to zirconia in the ferrule terminals of optical fibers. High dimensional accuracy, low linear expansion coefficient, low shrinkage rate, and high bending strength are required.
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- Flexible Printed Circuit Board
- A printed circuit board that uses a thin and flexible insulating base material and can be bent or changed in shape. High heat resistance, low water absorption, low dielectric tangent, dimensional stability, and mechanical strength are required.
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- Headphone (earphone) diaphragm
- A diaphragm that uses the power of a magnet and an audio signal to move the air and convert the audio signal into sound. It is required to have vibration-damping properties, high elongation at high temperatures, and light weight.