Adhesion

With SUMIKASUPER LCP, adhesion using commercially available adhesives (Table 5-6-1) is possible without any special surface treatment.
The bonded surface retains practical adhesive strength even after thermal aging at 250°C. Crystalline resins such as PPS may warp when the curing temperature is raised. However, warping does not occur with SUMIKASUPER LCP even when cured at a high temperature of 120 to 150°C, allowing for short processing times. For recommendations on how to use a particular adhesive, contact the adhesive manufacturer.

Adhesive Strength Measurement Method

The test conditions are as follows.

  • Test piece
    ASTM No.1 test piece (thickness 3.2mm)
  • Test method
    After applying the adhesive to the test pieces, they are overlapped by 10mm and cured in a hot air circulation oven.
  • Measurement of strength
    Measure the shear strength at a tensile speed of 1.67 x 10-4m/s.

Figure 5-6-1 Measurement Method of Adhesion Test

Figure 5-6-1 Measurement Method of Adhesion Test

Table 5-6-1 Adhesive Strength of SUMIKASUPER LCP with Commercial Adhesives

Unit: MPa

  Adhesive
TB2234D
(ThreeBond)		 Sumimac ECR-9173K
(Sumitomo Bakelite)
After curing 250°C,1hr
thermal aging		 230°C,1min
IR Reflow		 After curing 250°C,1hr
thermal aging
E5008 9.2 3.0 9.2 9.1 3.8
E6008 7.7 2.8 7.8 8.8 3.5
  Adhesive
Technodyne AH 7052T
(Taoka Chemical)		 Technodyne AH 6072K
(Taoka Chemical)		 Technodyne AH 062K
(Taoka Chemical)
After curing 250°C,1hr
thermal aging		 After curing 250°C,1hr
thermal aging		 After curing 250°C,1hr
thermal aging
E5008 6.2 4.6 6.7 4.3 6.6 3.8
E6008 7.0 4.4 6.1 4.2 5.6 5.0
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