Characteristics Required of the Material

Surface mounting technology (SMT) where electronic components are mounted on boards at high temperatures of 250 to 270°C has become common in recent years. Therefore, LCP is widely used for SMT-compatible connectors due to its excellent heat resistance, dimensional stability, and precision molding.
As the performance and miniaturization of electronic devices has progressed, the connectors that connect boards and FPC (flexible printed circuits) boards to cables and boards have become more dense, smaller and thinner, and have higher transmission speeds. Therefore the characteristics needed from LCPs have also becoming more sophisticated. There are many types of connectors depending on the purpose of the connection, and the characteristics required for LCPs also differ. We develop grades with high performance and high functionality based on the needs of our customers, and provide a diverse lineup.

Grade Lineup for Connector Applications

The following is the lineup of SUMIKASUPER LCP grades for connectors. All grades have thin-wall flowability, thin-wall strength, and low warpage according to the required characteristics of the connector.

Table 6-2-1 Grade Lineup for Connector

Filler	Features		E series Standard	E / SV series General-purpose and functionality	SZ / SR series High performance
Glass fiber	Standard		E6007LHF	E6007LHF-MR	SR1009 SR1009L
Glass fiber / inorganic or inorganic alone	Low warpage	Standard	E6807LHF E6808LHF	SV6808THF SV6808L	SZ6505HF SZ6506HF
		High flow	E6808UHF E6808GHF	SV6808GHF	SR2506
		Low anisotropy	E6810LHF E6810KHF	E6809U	SR2507 SZ4506
Dielectric constant control	Low dielectric constant and low dielectric dissipation factor		E4205R	E6205L	SR1205L

Characteristics of Grades for Connector Applications

(1) Thin-wall flowability

The thin wall flowability of 0.10mm, 0.12mm, 0.15mm, 0.20mm, and 0.30mm of SUMIKASUPER LCP is shown below. SUMIKASUPER LCP exhibits the highest level of flowability among the many types of LCP.

Figure 6-2-1 Mold for Thin-Wall Flow Length Measurement

Figure 6-2-2 Thin-Wall Flowability of SUMIKASUPER LCP 1

Figure 6-2-3 Thin-Wall Flowability of SUMIKASUPER LCP 2

(2) Thin-wall strength

The following shows the thin-wall strengths for 0.10mm, 0.20mm, and 0.30mm grades of SUMIKASUPER LCP for connectors. SUMIKASUPER LCP has high mechanical strength even with a thin wall of 0.30mm or less.

Figure 6-2-4 Thin-Wall Strength Test Method

Test piece shape	: Plate-shaped test piece
Test piece width	: 5mm
Test piece thickness	: 0.10, 0.20, 0.30mm
Distance between two fulcrums	: 3mm(0.10mm), 5mm(0.20, 0.30mm)
Test speed	: 2mm

Figure 6-2-5 Thin-Wall Strength of SUMIKASUPER LCP

(3) Low warpage

For SMT connectors, poor soldering may result when the connector warps and deforms due to expansion/contraction of the LCP resin from heating during the reflow process and release of resin residual stress. The SUMIKASUPER LCP grades for connectors have excellent low warpage even before and after heating in the reflow process.

Figure 6-2-6 FPC Model Connector and Reflow Test Conditions

Warp Measurement Method
Measuring equipment : Core9030C (manufactured by CORES Corporation)
Reflow conditions : as shown below
Measurement method : The amount of warpage of the FPC model connector before and after reflow was calculated.
Warpage calculation method : The height of the lines A-A' and B-B' connecting both ends in the longitudinal direction are measured, the least square plane of the connector is calculated using the least squares method, and the distance between the lowest and highest points are then calculated as warpage.

Figure 6-2-7 FPC Model Connector Warpage of SUMIKASUPER LCP

Grade Selection Guide for Connector Applications

There are many types of connectors depending on the purpose of the connection, and the characteristics required for materials also differ.
When selecting a grade, it is necessary to consider the required characteristics and shape of the connector (especially the wall thickness of the molding). The following is a list of typical connector types and recommended grades. Some of the newest grades are not listed in the catalog, so please contact us about grade selection and other technical questions.

Table 6-2-2 Recommended Grades of SUMIKASUPER LCP by Connector

Connector type	Connector shape	Recommended grade	Features
Micro connector (0.3 to 0.4mm pitch) Board to board connector housing Board to FPC connector housing FPC connector housing	Ultra-compact/Fine pitch/Low profile	E6808UHF E6808GHF SV6808THF SV6808GHF SZ6505HF SR2506 SR2507	High flow / Low warpage / Blister resistant High flow / Low warpage / High strength High flow / Ultra-low warpage High flow / Low warpage / High thin-wall strength Super high flow / Low warpage Super high flow / Low warpage / High weld Super high flow / Ultra-low warpage / Low linear thermal expansion
Card connector SIM card connector housing SD card connector housing 2 in 1 and 3 in 2 card connector housings	Flat plate shape/Ultra-thin wall/Insert	E6808UHF SV6808THF SV6808GHF SZ6505HF SZ6506HF SR2506 SR2507	High flow / Low warpage / Blister resistant High flow / Ultra-low warpage High flow / Low warpage / High thin-wall strength Super high flow / Low warpage Super high flow / Ultra-low warpage Super high flow / Low warpage / High weld Super high flow / Ultra-low warpage / Low linear thermal expansion
Card edge (DDR, M2, S-ATA) connector DDR connector housing M2(NGFF) connector housing S-ATA connector housing	Uniaxial long shape/High strength	E6808UHF SV6808THF E6808LHF E6809U E6810KHF E6810LHF	High flow / Low warpage / Blister resistant High flow / Ultra-low warpage High flow / Low warpage / High strength Low warpage / Low anisotropy / Blister resistant Low warpage / Low anisotropy Low warpage / Low anisotropy
I/O connectors USB connector housing HDMI connector housing I/O connector related housing	Small size/High density/ Robust/High speed transmission	E6807LHF E6808LHF E6808UHF SV6808THF SV6808GHF E6809U E6810KHF	High flow / Low warpage / High strength High flow / Low warpage / High strength High flow / Low warpage / Blister resistant High flow / Ultra-low warpage High flow / Low warpage / High thin-wall strength Low warpage / Low anisotropy / Blister resistant Low warpage / Low anisotropy
Board to board connector, floating connector Board to board connector housing Floating connector housing Board to cable connector housing Automotive connector housings	Rectangular/Robust/Heat resistant/ High speed transmission	E6006L E6008 E6007LHF E6007LHF-MR E6807LHF SV6808THF	Standard / High strength Standard / High flow High flow / High strength High flow / High strength / Mold release High flow / Low warpage / High strength High flow / Ultra-low warpage
CPU socket connector CPU socket connector housing	Flat plate shape/Grid type/ Heat resistant	E6007LHF E6807LHF E6808UHF SV6808L	High flow / High strength High flow / Low warpage / High strength High flow / Low warpage / Blister resistant High heat resistance / High strength
Connector for high-speed transmission, coaxial connector Coaxial connector housing FPC connector for high speed transmission Backplane connector for high speed transmission Mezzanine connector	Rectangle/High density/Robust/ High speed transmission	E6808UHF SV6808THF SZ6506HF SR2506 SR2507 E6205L SR1205L	High flow / Low warpage / Blister resistant High flow / Ultra-low warpage Super high flow / Ultra-low warpage Super high flow / Low warpage / High weld Super high flow / Ultra-low warpage / Low linear thermal expansion Low dielectric Low dielectric / Low dielectric dissipation factor