Heat Resistance of SUMIKASUPER LCP

Thermal Decomposition Temperature

The results from a TGA (Thermogravimetric Analysis) (shown in Figure 1 and Table 1) indicate that the temperature of thermal decomposition in nitrogen is quite high, being approximately 450 deg C, and the decrease in mass at a temperature of 500 deg C is extremely small (only 1%). Therefore, SUMIKASUPER LCP can be seen to exhibit high thermal stability.

Figure 1 : TGA Curve

Figure 1 : TGA Curve

Table 1 : Thermal Decomposition Temperature

Decomposition temperature(deg C)
1%weight loss
Main decomposition
E5008 520 559
E4008 520 555
E6008 500 550
E6807LHF 500 550
PBT(GF30%) 370 421
PPS(GF40%) 460 556
Measuring instrument : TG50 model by Simadzu Seisakusho
Temperature ramp rate : 10 deg C/min
Atmosphere : Under nitrogen

Deflection Temperature Under Load

The approximate deflection temperature under load for each grade of SUMIKASUPER LCP is as follows:

E5000 Series 330~360 deg C
E4000 Series 310~320 deg C
E6000 Series 270~290 deg C
E6000HF Series 250~280 deg C

Long-term Heat Resistance

SUMIKASUPER LCP possesses outstanding long-term heat resistance

  • UL Temperature Index
    Table 2, below, indicates the relative temperature index values (UL746B) for SUMIKASUPER LCP.

Table 2 : Relative Temperature Index


Grade Item
Electric Mechanical
With impact Without impact
E5008 240 220 240
E5008L 240 220 240
E4008 200 200 240
E6008 220 200 240
  • Heat Aging Resistance(260 deg C)
    Figure 2 depicts the strength retention characteristics of SUMIKASUPER LCP in an atmosphere having a temperature of 260 deg C.
Figure 2 :
Heat Aging Property of SUMIKASUPER LCP
(260 deg C in air)
Figure 2 : Heat Aging Property of SUMIKASUPER LCP(260 deg C in air)

Continuous Service Temperature

Figure 3 : Continuous Service Temperature and DTUL

Figure 3 : Continuous Service Temperature and DTUL

Soldering Heat Resistance

SUMIKASUPER LCP possesses the highest soldering heat resistance among all heat-resistant engineering plastics.

Soldering Heat Resistance
Dimensions of specimen : JIS K7113 1(1/2)dumbbell 1.2mmt,
Solder : H60A (Tin60%, Iead40%)

*The values within the above graph represent the limit, in seconds (">60" means the product will not deform, even when soaked in a solder bath for 60 seconds).
Blistering may occur, even in temperatures less than the above deformation temperatures, depending upon the molding conditions.

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